Facility water · FWS
The building's water loop that ultimately rejects heat to the outdoors, kept separate from the clean chip-cooling loop.
Current numbers
~41 °C FWS -> 45 °C rack coolantNVIDIA’s named 41°C FWS/45°C rack-coolant example can support dry rejection when the local approach and ambient envelope permit it; OCP’s October 2024 roadmap separately proposes 30°C at the silicon/TCS interface
~3–5 °Ctypical CDU heat-exchanger approach temperature (lower = warmer facility water, more free cooling)
~3–5 °CCDU heat-exchanger approach (FWS→TCS); Deschutes 2 MW CDU targets ~3 °C ATD