HBM3E

An enhanced generation of high-bandwidth memory shipping in 2024-2025 accelerators, faster and denser than HBM3.

Current numbers

80 → 288 GB → ~1 TBHBM capacity per accelerator package: H100 80 GB; HGX B200 180 GB; B300 288 GB (HBM3E); Rubin Ultra ~1 TB HBM4E on a four-chiplet package (roadmap)as of 2026-08 · register ↗

~$300 → ~$500–600+ per stackreported 12-Hi stack price, HBM3E → HBM4 (8–12 stacks per accelerator)as of 2026-01 · register ↗

192 GBHBM3E per Ironwood (TPU v7) chip @ 7.37 TB/s; 4,614 FP8 TFLOPS; 6x memory vs Trilliumas of 2026 (GA) · register ↗

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