Warm-water direct-to-chip PUE illustration in the cited design discussion
1.05-1.15estimate
| Value kind | estimate — Interpret this value according to its displayed kind, scope, source, and as-of date. |
|---|---|
| Scope | No matched measured population establishes an architecture-wide 1.05–1.15 envelope. This cited design illustration is not an annual guarantee; climate/load bins, rack heat capture, power-chain losses and meter boundaries govern a project’s result. |
| As of | 2025 (cited design discussion) |
| Source | SemiAnalysis, Datacenter Anatomy Part 2, cited 2025 design discussion; this range is a screening illustration, not an Uptime cooling-architecture statistic. |
| Review | checking…review by 2026-09-24 · fast cadence |
| Recorded changes | last 2026-09-16 · 2 revisions tracked |
| Claim id | pue-band-for-warm-water-direct-to-chip-liquid |
Where the guide uses it
- 5.7 Facility Water Loops & Warm-Water Cooling
- 15.1 Efficiency Metrics: PUE, WUE, ERF, REF & the Post-PUE Metric Stack
- 15.2 Energy Efficiency: Cooling, Free Cooling, Setpoints & Power-Chain Losses
← Full numbers register — every date-stamped figure in the guide, with revision history.