With a top-mounted plate, buried-die heat travels through overlying material; die interconnect and substrate core are distinct boundaries.
Guide mechanism schematic (package heat route)derived
| Value kind | derived — Derived values are guide calculations; their result is only as fixed as the stated inputs, scope, and method. |
|---|---|
| Scope | cowos-package-section diagram only: buried-die heat path through overlying material under a top-mounted plate; die interconnect and substrate core are distinct boundaries. Schematic; no OEM dimensions, ratings or measured results. |
| As of | 2026-09-08 |
| Source | TSMC; UCIe Consortium — primary mechanism references; guide synthesis September 8, 2026. |
| Derivation | With a top-mounted plate, buried-die heat travels through overlying material; die interconnect and substrate core are distinct boundaries. |
| Review | checking…review by 2027-03-08 · standard cadence |
| Recorded changes | none recorded |
| Claim id | part7-package-heat-route |
Where the guide uses it
Not quoted in a chapter yet; it is kept in the curated register.
← Full numbers register — every date-stamped figure in the guide, with revision history.