OCP's white paper Thermal Boundaries in AI Infrastructure (v1.00, 12 October 2026; Cooling Environments; authors from Promersion, Oracle, Meta and Avayla) projects the physics boundary of single-phase cold-plate cooling at roughly 4,000 W for a reticle-class die (about 850 mm²) on current silicon roadmaps.
~4,000 W per reticle-class dieforecast
| Value kind | forecast — Forecasts are time-bound outlooks, not specifications; test decisions across plausible scenarios. |
|---|---|
| Scope | A projection the paper derives from calorimetric, hydraulic and mechanical constraints (Appendix B) for a die of about 850 mm²; shipping parts draw several times less. The authors expect economics (efficiency, total cost and lost serviceability), rather than this wall, to move the industry off single-phase cold plate. |
| As of | 2026-10 |
| Source | Open Compute Project, White Paper: Thermal Boundaries in AI Infrastructure, v1.00, 12 October 2026 (Cooling Environments; Brink, Kumar, Mills, Mullick) · §5.6 Forced or gradual (p. 24); §8.2 Single-phase cold plate (pp. 35–36); Appendix B |
| Review | checking…review by 2027-04-17 · standard cadence |
| Recorded changes | last 2026-10-19 |
| Claim id | ocp-thermal-boundaries-single-phase-cold-plate-4000-w |
Where the guide uses it
Not quoted in a chapter yet; it is kept in the curated register.
← Full numbers register — every date-stamped figure in the guide, with revision history.