Choose a package only if its die crossing and heat path both close — conditional result
A: 8.8 W link and 24 K rise; B: about 26 W, rejected. A flips above about 2.3 TB/s or 0.050 K/W.derived
| Value kind | derived — Derived values are guide calculations; their result is only as fixed as the stated inputs, scope, and method. |
|---|---|
| Scope | Transmitted rate = 1.0×10¹² B/s × 8 bit/B × 1.10 = 8.8 Tb/s. Combined endpoint power A = rate × 1.0 pJ/bit = 8.8 W; B at 3.0 pJ/bit needs about 26 W and exceeds 20 W. Buried-die rise = 600 W × 0.040 K/W = 24 K, within 30 K. A’s payload threshold is 20 W/(8×1.10×1.0 pJ/bit), about 2.3 TB/s; 2.3 itself is above that exact bound. Independently, the thermal crossover is 30 K/600 W = 0.050 K/W; at 0.060 K/W the rise is 36 K and fails. |
| As of | 2026-09 |
| Source | UCIe Consortium specification catalogue — method reference; guide-authored hypothetical scenario September 8, 2026. No supplier quote or test measurement. |
| Derivation | Transmitted rate = 1.0×10¹² B/s × 8 bit/B × 1.10 = 8.8 Tb/s. Combined endpoint power A = rate × 1.0 pJ/bit = 8.8 W; B at 3.0 pJ/bit needs about 26 W and exceeds 20 W. Buried-die rise = 600 W × 0.040 K/W = 24 K, within 30 K. A’s payload threshold is 20 W/(8×1.10×1.0 pJ/bit), about 2.3 TB/s; 2.3 itself is above that exact bound. Independently, the thermal crossover is 30 K/600 W = 0.050 K/W; at 0.060 K/W the rise is 36 K and fails. |
| Review | checking…review by 2027-03-08 · standard cadence |
| Recorded changes | last 2026-09-16 |
| Claim id | guide2-t29-7-7-result |
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