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UCIe · Universal Chiplet Interconnect Express

An open standard for connecting chiplets from different vendors within one package.

Current numbers

>20 Tbps/mmUCIe 3.0 signaling reaches 64 GT/s; a third-party 64 Gbps PHY demonstration exceeds 20 Tbps/mm edge density, while UCIe-3D reaches up to ~300 TB/s/mm² at 1 µm pitchas of 2026 · register ↗
UCIe 3.0UCIe catalogue; contract the implemented profileas of 2026 · register ↗

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