TDP · Thermal Design Power
A vendor-defined thermal/design rating used to size a product's power and cooling envelope. Its definition and test basis vary by product; TDP is not necessarily measured sustained electrical input, typical workload draw, or maximum/peak power.
Use the vendor's named product definition and test basis. Keep TDP separate from measured sustained input, typical workload power, peak/transient limits, and the system-level rack design rating.
Also written as: Thermal Design Power
Current numbers
132 kW nominal TDP: 115 kW liquid + 17 kW airNVIDIA GB200 NVL72 by HPE: 132 kW nominal rack TDP, with 115 kW liquid and 17 kW air heat-removal duties
188 kW (Max Q) / 228 kW (Max P)Vera Rubin NVL72 rack power — 188 kW Max Q / 228 kW Max P (Pegatron); 330 kW cabinet TDP as the facility design basis (NVIDIA DSX)
135 kW TDP; 155 kW peak; up to 142 kW facility design basis; ~90% liquid / ~10% airGB300 NVL72 rack TDP (to ~155 kW peak); ~90% heat to liquid, ~10% to air