TDP · Thermal Design Power
The sustained power and heat a chip package must dissipate; the per-chip number that drives rack density and cooling.
Current numbers
~132 kW nominal; ~155 kW peakper HPE GB300 NVL72 rack — 132 kW nominal TDP and approximately 155 kW peak electrical design power; HPE recommends provisioning busways for 192 kW
~132–142 kW nominal; ~155 kW peakGB300 NVL72 rack TDP (to ~155 kW peak); ~90% heat to liquid, ~10% to air
~1.5× TDPEDPp (electrical design power, peak) as the real sizing basis vs nameplate TDP