TDP · Thermal Design Power
A vendor-defined thermal/design rating used to size a product's power and cooling envelope. Its definition and test basis vary by product; TDP is not necessarily measured sustained electrical input, typical workload draw, or maximum/peak power.
Use the vendor's named product definition and test basis. Keep TDP separate from measured sustained input, typical workload power, peak/transient limits, and the system-level rack design rating.
Also written as: Thermal Design Power
Current numbers
132 kW nominal TDP: 115 kW liquid + 17 kW airNVIDIA GB200 NVL72 by HPE: 132 kW nominal rack TDP, with 115 kW liquid and 17 kW air heat-removal duties
132 kW HPE GB200 nominal TDP / up to 142 kW GB300 facility basisper dense training rack (HPE GB200 NVL72 ~132 kW nominal TDP; GB300 up to ~142 kW facility basis)
188 kW (Max Q) / 228 kW (Max P)Vera Rubin NVL72 rack power — 188 kW Max Q / 228 kW Max P (Pegatron); 330 kW cabinet TDP as the facility design basis (NVIDIA DSX)