TCS · Technology Cooling System
The secondary liquid loop that carries heat from IT equipment to the CDU; the facility loop rejects that heat onward to the outside world.
Current numbers
132 kW nominal TDP: 115 kW liquid + 17 kW airGB200 NVL72 named profile: ~115 kW liquid plus ~17 kW residual air; both the TCS and room-air duties must close at supported conditions
~41 °C FWS -> 45 °C rack coolantNVIDIA’s named 41°C FWS/45°C rack-coolant example can support dry rejection when the local approach and ambient envelope permit it; OCP’s October 2024 roadmap separately proposes 30°C at the silicon/TCS interface
~50-micronfull-flow TCS filtration (~50-micron typical); separate side-stream polishing can be sub-micron (for example 0.2-micron on premium units)