Reticle
The maximum area a lithography tool can pattern in one exposure (~858 mm2), capping how large a single die can be.
Current numbers
858 mm² (26 × 33 mm)single reticle field (≈26×33 mm) — the area limit every advanced-packaging technique exists to defeat
~336 Btransistors per Rubin GPU (dual-die, 4-reticle CoWoS-L) — 1.6x Blackwell's ~208 B
3.5× → 5.5× (2026) → 9.5× (dev)TSMC package roadmap: distinguish interposer reticle multiple from 100 × 100 mm substrate footprint