Reticle
The maximum area a lithography tool can pattern in one exposure (~858 mm2), capping how large a single die can be.
Current numbers
~336 Btransistors per Rubin GPU (dual-die, 4-reticle CoWoS-L) — 1.6x Blackwell's ~208 B
~858 mm²single reticle field (≈26×33 mm) — the area limit every advanced-packaging technique exists to defeat
3.5× → 5.5× (2026) → 9.5× (dev)CoWoS-L reticle multiple: 3.5× in production since 2024; 5.5× certified 2025 (100×100 mm), volume production starting 2026; 9.5× in development (~2027 target)