MR-MUF · Mass Reflow Molded Underfill
SK hynix's HBM stacking process: microbump joints reflowed together, then filled with molded underfill. It builds HBM4 and its 16-high parts on Advanced MR-MUF, not hybrid bonding.
SK hynix's HBM stacking process: microbump joints reflowed together, then filled with molded underfill. It builds HBM4 and its 16-high parts on Advanced MR-MUF, not hybrid bonding.