Chiplet
A smaller die combined with others in one package, letting designers mix processes and beat single-die size limits.
Current numbers
80 → 288 GB → ~1 TBHBM capacity per accelerator package: H100 80 GB; B200 180 GB; B300 288 GB (HBM3E); Rubin Ultra ~1 TB HBM4E on a four-chiplet package (roadmap)
~$300M–$1B+practitioner NRE range for a full AI-accelerator program (node/die/chiplet dependent)