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GuideGlossaryThermal Design Power

Thermal Design Power · TDP

Sustained heat-dissipation requirement of a processor, setting cooling and rack-density needs.

Current numbers

~132 kW nominal; ~155 kW peakper HPE GB300 NVL72 rack — 132 kW nominal TDP and approximately 155 kW peak electrical design power; HPE recommends provisioning busways for 192 kWas of 2026-05-04 · register ↗
~132–142 kW nominal; ~155 kW peakGB300 NVL72 rack TDP (to ~155 kW peak); ~90% heat to liquid, ~10% to airas of 2026-03 · register ↗
~1.5× TDPEDPp (electrical design power, peak) as the real sizing basis vs nameplate TDPas of 2026 · register ↗

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