Co-Packaged Optics · CPO
Bringing optical engines into the chip package to push high-speed links further than copper allows.
Current numbers
~0.5%CPO share of AI-data-center optical modules in 2026 — a top-of-fabric, highest-pressure-link technology spreading outward
~30W → ~9Wper-1.6T-link power, pluggable DSP vs co-packaged optics — ~3.5x energy saving, 10x resilience
~3.5xCPO power efficiency gain vs pluggable optics (NVIDIA silicon photonics; ≈70% optical-interconnect power cut, Broadcom Davisson)